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Guidelines for Design, Selection and Application of Potting Materials and Encapsulation Processes Used for Electronics Printed Circuit Board Assembly
1 SCOPE
1.1 Introduction
Potting and Encapsulation is a very broad topic and can include anything from toys to high power applications. There is no clear industry-wide definition that would decipher distinct differences between either. This document will cover known terminology associated with this process as related only to electronic printed circuit board assembly and protection.
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