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Guidelines for Cleaning of Printed Boards and Assemblies
1 OVERVIEW
1.1 Scope
This manual will only include assembly process printed wiring assembly cleaning. The corresponding information on printed wiring board cleaning will be contained in a separate companion document.
1.2 Purpose
The purpose of this document is to collect and update all the pertinent information on printed wiring assembly (PWA) cleaning in a single, easy to revise/updated document.
1.3 Background
Information on cleaning printed circuit boards (PCBs), printed wiring boards (PWBs), and printed wiring assemblies (PWAs) during manufacture could be found within a number of IPC documents and handbooks, specifically:
• CH-65 Guidelines for Cleaning of Printed Boards and Assemblies
• SM-839 Pre and Post Solder Mask Application Cleaning Guidelines
• SC-60 Post Solder Solvent Cleaning Handbook
• SA-61 Post Solder Semi-Aqueous Cleaning Handbook
• AC-62 Aqueous Post Solder Cleaning Handbook
While collecting relevant information in various places was recorded for its members to use, one was never sure that one had all the needed information at hand.
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