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IPC-SM-784 : 1990

Guidelines for Chip-on-Board Technology Implementation

Standard Details

1.0 INTRODUCTION

The ancient philosopher Heraclitus said, ‘‘There is nothing permanent except change.’’ This aphorism is perhaps nowhere better exemplified than it is in the field of electronics fabrication. Since the middle of this century, the rate of technological change in the electronics industry has accelerated at a dizzying pace. No sooner does one garner a sense of the current technology base than it is outdated. Technology has evolved from simple point-to-point discrete wiring to very complex multilayer rigid-flex printed wiring boards; from metal eyeleted through holes to through holes metallized in vacuum using sputtering technology; and from circuit lines big enough to be drawn by hand to microscopically small circuit conductors.

General Information

Status : ACTIVE
Standard Type: Main
Document No: IPC-SM-784 : 1990
Document Year: 1990

Life Cycle

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IPC-SM-784 : 1990
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