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Guidelines for Accelerated Reliability Testing of Surface Mount Solder Attachments
1.0 SCOPE
This document provides guidelines for accelerated reliability testing of surface mount solder attachments and for evaluating and extrapolating the results of these accelerated reliability tests towards actual use environments of electronic assemblies. Background and design information is provided for an understanding of the accelerated test issues.
1.1 Purpose
The purpose of accelerated reliability testing is to provide confidence that the design and the manufacturing/assembly processes are capable of meeting the intended goals of product performance. These guidelines provide adequate commonality and validity for accelerated reliability tests:
• To allow comparison of results from different test programs
• To provide the generic technical understanding of the underlying issues necessary to the design for adequate reliability
• To permit the analytical prediction of reliability based on a generic database and technical understanding
• To reduce cost and avoid time-consuming testing of every design iteration
• To establish practical alternatives to replace the excessively long test durations necessary to verify reliability of products subject to severe use environments or low failure tolerances
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