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IPC-HDBK-005 - Handbook : 2006

Guide to Solder Paste Assessment

Standard Details

1 SCOPE

This handbook is a companion to the solder paste standard J-STD-005 and should be considered to be a guide to help assess the applicability of a solder paste for its use in surface mount technology (SMT) processes. This document also suggests some test methods that can help with designing and testing solder pastes. It is intended for use by both vendors and users of solder paste.

General Information

Status : ACTIVE
Standard Type: Main
Document No: IPC-HDBK-005 - Handbook : 2006
Document Year: 2006

Life Cycle

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ACTIVE
IPC-HDBK-005 - Handbook : 2006
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