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Generic Requirements for Surface Mount Design and Land Pattern Standard
1 SCOPE
This document provides generic requirements on land pattern geometries used for the surface attachment of electronic components, as well as surface mount design recommendations for achieving the best possible solder joints to the devices assembled.
1.1 Purpose
The intent of the information presented herein is to provide the appropriate size, shape and tolerance of surface mount land patterns to insure sufficient area for the appropriate solder .llet to meet the requirements of IPC J-STD-001, and also to allow for inspection, testing, and rework of those solder joints. Designers can use the information contained herein to establish standard land pattern geometries not only for manual designs but also for computer-aided design systems. Whether parts are mounted on one or both sides of the printed board, subjected to wave, reflow, or other type of soldering, the land pattern and part dimensions should be optimized to insure proper solder joint and inspection criteria.
Land patterns become a part of the printed board circuitry and they are subject to the producibility levels and tolerances associated with fabrication and assembly processes. The producibility aspects also pertain to the use of solder mask and the registration required between the solder mask and the conductor patterns.
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