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Generic Guideline for Land Pattern Design
1 SCOPE
This document provides generic guidelines on land pattern geometries used for the attachment of electronic components to a printed board, as well as design recommendations for achieving the best possible solder joints to the devices assembled. Adjustments to the information in this guideline may be required to meet company and/or board technology requirements. It is recommended that a company should document the modifications to the IPC-7352 content in corporate command media documentation.
A land pattern is the representation of the area and features on a printed board needed for a component to be placed and attached to the printed board during an assembly process. The land pattern is usually built using ECAD Library tools.
1.1 Purpose
The intent of the information presented herein is to provide the appropriate size, shape and tolerance of throughhole and surface mount land patterns to ensure sufficient area for the appropriate solder fillet to meet the requirements of IPC J-STD-001, and to allow for inspection, testing and rework of those solder joints. Designers can use the information contained herein to establish guideline land pattern geometries not only for manual designs but also for computer-aided design systems. Whether parts are mounted on one or both sides of the printed board and are subjected to wave, reflow, or other type of soldering, the land pattern and part dimensions should be optimized to ensure proper solder joint and inspection criteria.
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