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General Requirements for Anisotropically Conductive Adhesive Films
1.0 SCOPE
This document covers requirements and test methods for anisotropically conductive adhesive films used to bond and electrically connect components and for their long-term properties as a part of the printed wiring board assembly. Applications include the following: flexible PWB-to-glass, flexible PWB-to-rigid PWB, flip chip-to-glass, flip chip-toflexible PWB, flip chip-to-rigid PWB, and fine pitch SMD. The adhesive film may be supplied pre-attached to a flexible circuit or other product.
1.1 Purpose
This standard defines anisotropically conductive adhesive films (also known as Z-axis films, ZAF) through specification of test methods and inspection criteria.
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