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IPC-DAC-2552 : 2022

General Electronic Components Model Based Definition (MBD) Standard

Standard Details

1 SCOPE

This standard defines the set of specification elements for components and parts to be assembled and connected onto printed boards. These specification elements mainly cover the component specifications in strong correlation with board-level manufacturing (e.g., SMT, THT, Press-Fit), assembly and board-level reliability.

1.1 Purpose

This standard provides a digital model-based standard defined to realize efficient and high-quality digital design of board-level assembly (e.g., mounting, assembly, reliability) and to support the final realization of virtual manufacturing of electronic assembly.

General Information

Status : ACTIVE
Standard Type: Main
Document No: IPC-DAC-2552 : 2022
Document Year: 2022

Life Cycle

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ACTIVE
IPC-DAC-2552 : 2022
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