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Evaluation of Steam Aging on Alternative Finishes
OBJECTIVES
The purposes of this round robin test were to
1. Determine the effect of steam aging exposure on components employing a variety of solderable finishes other than hot solder dip over a copper substrate.
2. Provide data to support refinement of the standards.
3. Compare the effect of steam aging to other solder test variables, such as different testers and new vs. degraded samples.
INTRODUCTION
The purpose of this round robin test program is to determine the effect of the steam aging environment at fixed temperatures on the various metals and platings used on electronic components and printed wiring boards. Many studies have been performed by various industry representatives. This round robin capitalizes on this work to help establish correlations between various testers in order to verify the effect of steam aging on solderability and explore test repeatability and reproducibility.
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