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End-Item DPMO for Printed Circuit Board Assemblies
1 OVERVIEW
1.1 Scope
This document is intended to define standard methods for the categorization of defects related to electronic printed board assemblies (PBAs). This document will provide consistent methodologies for calculating the following benchmark indices:
• Defects Per Million Opportunities Index (DPMO Index)
• Component DPMO
• Placement DPMO
• Termination DPMO
• Assembly DPMO
DPMO as applied in this standard is a measurement taken on completed product. Only those defects detected or discovered at an assembly’s completed product evaluation are to be included in the calculations. A companion standard, IPC-9261 In-Process DPMO and Estimated Yield for PWAs is used to develop DPMO indices for measuring in-process assembly steps.
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