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Design Standard for Thick Film Multilayer Hybrid Circuits
1.0 SCOPE
This standard covers the requirements and considerations for the design of multilayer hybrid circuits based on industry manufacturing capabilities.
1.1 Purpose
The purpose of this standard is to establish rules, principles, and other considerations for mechanical, electrical, and producible properties which the designer can use to select design features, and properties that will result in a multilayer hybrid circuit that will meet performance and cost requirements.
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