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Design Standard for Printed Electronics on Rigid Substrates
1 SCOPE
This standard establishes specific requirements for the design of printed electronic applications and their forms of component mounting and interconnecting structures on rigid substrates. Rigid substrates as applies to this standard are those that are not required to be flexed into a new shape for the purposes of assembly or operation. The rigid substrate can be conductive (e.g., rigid printed board or assembly), semiconductive or nonconductive.
1.1 Purpose
The requirements contained herein are intended to establish design principles and recommendations that shall be used in conjunction with the detailed requirements of a specific printed electronic application to produce detailed designs for the printed electronic. This standard is not intended for use as a performance specification nor as an acceptance document.
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