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Design Guide for High-Speed Cont rolled Impedance Circuit Boards
1 SCOPE
This guide is intended to be used by circuit designers, packaging engineers, printed board fabricators, and procurement personnel so that all may have a common understanding of each other’s area.
The goal in packaging is to transfer a signal from one device to one or more other devices, through a conductor. High-speed designs are defined as designs in which the interconnecting properties affect circuit performance and require unique consideration.
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