Standards Manage Your Business
We Manage Your Standards
Standards Manage Your Business
We Manage Your Standards
Design Guide for High Density Interconnects (HDI) and Microvias
1 SCOPE
This document describes various via formations, materials, and design guidelines used in high density interconnects (HDI) and microvias. Microvias are processed/plated holes £0.15 mm in diameter.
1.1 Introduction
This document is intended to educate the user on the formation of microvias and the selection of wiring density, design rules, interconnects, and materials. It is intended to provide design guidelines for PWBs utilizing microvia technologies.
1.2 General
This document is intended to help in the selection of the preferred advanced technology for electronic packaging. The microvia PWBs are commonly referred to as build-up (BU) or sequential build-up (SBU) PWBs. These design rules apply to the BU and SBU interconnects using materials defined in IPC/JPCA-4104. The characteristics of these materials are found in Section 5.
Currently Viewing
Expand Your Knowledge and Unlock Your Learning Potential - Your One-Stop Source for Information!
© Copyright 2025 BSB Edge Private Limited.
