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Design and Assembly Process Implementation for Embedded Circuitry
1 SCOPE
This document describes the design, materials and assembly challenges associated with implementing embedded circuitry into a printed board. It covers various aspects of embedded circuitry related with the design, selection, processing and testing to achieve a completed multilayered structure that is ready for surface mount and/or through-hole component attachment.
1.1 Purpose
The target audiences for this document are product developers, design/process engineers and technicians who develop electronic assemblies that include embedded circuitry in the printed board as a part of the final product. The purpose is to provide useful and practical information to those who are involved in the decision making of either formed or placed, passive or active components and to help establish selection criteria, inspection techniques, testing processes and reliability test validations.
1.1.1 Intent
This document identi.es characteristics that influence the successful implementation of a robust embedded circuitry process. In many applications, the variation between forming and placing methods and materials are reviewed with the intent to highlight signi.cant differences that relate to the decision as to when, why or how to establish the quality and reliability of the .nal product. The information also establishes the robustness that the embedded portion of the product can survive the continued processing in order to complete an embedded circuitry printed board assembly.
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