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Design and Assembly Process Implementation for BGAs
1 SCOPE
This document describes the design and assembly challenges for implementing Ball Grid Array (BGA) and Fine Pitch BGA (FBGA) technology. The effect of BGA and FBGA on current technology and component types is also addressed. The focus on the information contained herein is on critical inspection, repair, and reliability issues associated with BGAs.
1.1 Purpose
The target audiences for this document are managers, design and process engineers, and operators and technicians who deal with the electronic assembly, inspection, and repair processes. The intent is to provide useful and practical information to those who are using BGAs and those who are considering BGA implementation.
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