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Cover and Bonding Material for Flexible Printed Circuitry
1 SCOPE
This standard establishes the classification system, the qualification and quality conformance requirements for dielectric films coated with an adhesive on one or both sides, which are to be used as cover material and/or bondply for flexible printed circuitry, and supported or unsupported adhesive films to be used in the fabrication of flexible printed circuitry.
1.1 Purpose
This specification addresses the requirements for procurement of dielectric films coated with an adhesive on one or both sides flexible printed board applications.
1.2 Classification System
The system described in 1.1.1 through 1.1.2.6 identifies adhesive coated dielectric films and flexible adhesive bonding films.
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