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Composite Metallic Material Specification for Printed Wiring Boards
1.0 SCOPE
This specification covers the requirements for copper/invar/ copper (CIC), copper/molybdenum/copper (CMC), threelayer composite. The CIC material consists of copper bonded to each side of a layer of invar (nominal 36% nickel and 64% iron alloy). The copper clad molybdenum consists of copper bonded to each side of molybdenum.
1.1 Purpose
This specification addresses the requirements for procurement of copper/invar/copper and copper/ molybdenum/copper for use in electronic applications.
1.1.1 Applications
Printed boards with ground and power planes and/or metal cores.
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