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Component Packaging and Interconnecting with Emphasis on Surface Mounting
1.0 INTRODUCTION
Today’s advanced electronic designs combine miniaturization and weight savings with high performance and low power consumption. To achieve all this, electronic assemblers often use surface mount technology, either alone or in combination with other sophisticated attachment processes. This document examines key issues in advanced packaging techniques. These guidelines provide information on what type of parts are available, the techniques and processes necessary for their proper use, possible advantages, disadvantages or problems, how to start implementation, and where to find additional information. Since no one technology will provide all of the answers, the guidelines establish criteria for intermixing the processes, and define the necessary steps for producing quality electronic equipment. When other specific documents are cited, they should be reviewed for the current requirements. Where appropriate, sections from other IPC documents have been excerpted.
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