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Classification of Passive and Solid State Devices for Assembly Processes
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This industry standard outlines worst case industry solder assembly process conditions for passive and solid state electronic devices (hereafter referred to as “devices). This standard provides evaluation procedures to determine whether a device can be safely subjected to those solder assembly processes and still meet all device specifications and reliability and quality expectations. This standard is not to be used for evaluating sockets and connectors, instead reference EIA-364-56 and EIA- 364-61.
The classification requirements of this document are required for passive devices.
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