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An Introduction to Tape Automated Bonding Fine Pitch Technology
1.0 INTRODUCTION
The use of fine pitch technology will increase with the increasing use of higher pin count devices such as Application-Specific Integrated Circuits (ASICs) and microprocessors. A fine pitch package is any package with lead pitches 0.625 mm [0.025] or less as long as the package is molded or encapsulated to allow pretesting before placement on the substrate. The maximum size of the package is controlled by, among other things, the ability of the pick-and-place machine to accurately place the device on the substrate. This size is generally around 37.5 mm [1.5] maximum on each side. If the pin counts increase such that the package size must exceed this limit, the lead pitch must drop below 0.625 mm [0.025] to maintain the size around 37.5 mm [1.5], depending on the type of pick-and-place machine.
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